TSMC and Xilinx jointly announced the mass production of the industry's first heterogeneous 3D ICs, making Xilinx 28-nm 3D IC families all in mass production now, according to the Economic Daily News on October 22. TSMC provides Xilinx with its CoWoS (Chip-on-Wafer-on-Substrate) to develop 28-nm 3D ICs, and lays the foundation of their closer cooperation on 20-nm SoC (System on Chip) and 16-nm FinFET (Fin Field-Effect Transistor) processes. TSMC estimates that around 30 products requiring 20-nm or 16-nm processes will finish tape-out by the end of this year. Aside from Xinlinx, Oracle, Altera, Qualcomm, and LSI are expected to be the first customers adopting TSMC's 20-nm process, which is slated for production in the first quarter of 2014, said the report.